Reballing is a process in which the defective chip is removed and repaired through the application of lead-based solder (for greater reliability) on the chip and then it is placed back on the card or the chip is completely replaced and the At the same time, the lead-based solder is applied before being soldered back to the card. BGA chips are usually composed of hundreds of connections densely grouped in rows or patterns in order to save space within a circuit.
What is BGA?
BGA (Ball Grid Array) is a type of connection whose purpose is to join a component to the motherboard / printed circuit board (PCB) of a computer equipment by means of a series of tin solders or predetermined alloys. This type of connection is commonly used in the production and fixation of motherboard components for various electronic equipment such as mobile phones, video game consoles, laptops, etc. They usually have a very large number of terminals which are soldered by means of patterns to the mother card.
What is Reballing - BGA?
Also known as rebole, reballing (English) is a term used in the electronics industry to describe the process of desoldering, rewinding and welding back BGA components onto a motherboard / printed circuit board (PCB). This in order to restore the connection between the printed circuit board and the component. Once the procedure has finished the device returns to normal operation, which eliminates the need to replace the entire motherboard or printed circuit card. In some cases the motherboard is not available in the market to be completely replaced and this becomes the only solution to the problem at a much lower cost. Part of our goal as a hpservicecenters laptop repair company is to repair as many electronic devices as possible,
What problems can the reballing solve?
Today, almost all technological equipment is constituted inside by BGA components inside, from a simple Mayan key to a complex server. And all are prone to this type of failures, especially high density circuit boards, as is the case of laptops, video game consoles and high performance graphics cards. The welding that connects the BGA components usually fail due to the cycles of temperatures, time of use, exposure to heat and bad design of the cards or cooling system. Problems such as distorted video, lack of video, sudden shutdowns, are frequently related to the BGA components of manufacturers such as nVidia and ATI. These can usually be solved by means of reballing or replacement of the graphic chip (GPU).
Can I do reballing in my house?
The Internet is full of articles and videos of people trying to repair graphics cards, laptops, mobile phones by exposing the BGA component to direct heat. Some people get to the point of heating the components in the oven of the house, with hair dryers, applying direct fire or leaving the equipment on while it is covered in towels to increase the heat. The truth is that if you were lucky that one of these methods worked, it would only be for a few days and would incur a high risk and dangerous process both for the person who performs it and for the team itself. This practice could hinder its repair in the future and completely damage the motherboard. The correct way is to use machinery and professional tool to carry out reballing, which use controlled temperatures above 400 º C, this with the management of qualified personnel and the controlled environment to carry it out successfully. Therefore, the repair should only be carried out in a specialized workshop and by professionals like Authorized hp laptops service center in Bangalore.
Our reballing process is as follows:
- Inspection - the card is inspected to make sure that it is repairable and that it does not present any other type of physical damage.
- Preparation - heat sensitive components and plastic connectors are protected by special tapes resistant to high temperatures.
- Preheating - the card is heated to a controlled temperature and environment, to evaporate any type of humidity.
- Extraction - the identified component is removed, any solder residue is cleaned and prepared to be reboleado.
- Reballing - (rebole) is carefully applied the new high reliability welding.
- Re-weld - the BGA component is installed on the card again.
- Inspection - after cleaning the card and a physical inspection of the entire plate is carried out using a special microscope.
- Test - the equipment is tested for at least 48 hours with special software to monitor basic aspects of the repair.
Some of the equipment affected by this failure:
- Sony PlayStation 2, 3 and 4
- HP Pavilion G4 CQ32, G42 CQ56.
- HP Pavilion Series DV1000, DV2000, DV4000, DV5000, DV6000, DV9000.
- HP Pavilion Series DV4, DV5, DV6, DV7.
- HP Pavilion Entertaiment Series TX1000, TX1200, TX1300, TX2000.
- Compaq Presario Series F500, F700, V2000, V3000, V5000, V6000.
- Compaq Presario Series CQ1, CQ40, CQ42 CQ50, CQ60, G60, G62
- Dell Inspiron 1420, 1526, 1546.
- Dell Latitude D630, 360c.
- Dell Precision M2300.
- Dell Vostro 1310, 1400, 1510, 1710.
- Dell XPS M1330, M1530, 14, 16. '
- Toshiba Satellite NB100, L505, L515, L555, L645, C655, A300, L300, L645, L655
- Acer with AMD processors and Nvidia video. (Aspire 4520)
- Apple MacBook, MacBook Pro, MacBook Pro Retina with nVidia, Ati or integrated memories.
Symptom:
- Problems with the wireless card (WIFI)
- Equipment only lights lights, but there is no screen image.
- Distortion in video image, stripes, altered or muted colors.
- Computer does not recognize optical drive or hard drive randomly.
- Extreme slowness in performing everyday tasks.
- Re-starts, stops or sudden shutdowns.
- Overheating of the equipment.
- Team emits a series of beeps or lights with error codes.
If your team has these symptoms, you can contact online laptop repair whitefield to give you more information about the problem of your equipment and a solution.
